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Failure mechanism models for electromigration | IEEE Journals & Magazine | IEEE Xplore

Failure mechanism models for electromigration


Abstract:

This tutorial illustrates situations where electromigration (a wearout failure mechanism) in electronic devices can degrade performance. Electromigration and its relation...Show More

Abstract:

This tutorial illustrates situations where electromigration (a wearout failure mechanism) in electronic devices can degrade performance. Electromigration and its relation to microstructure is discussed. Temperature considerations are treated. A practical model for electromigration and two application examples of it are given. Qualitative design procedures for avoiding solid-state electromigration failure are briefly discussed.<>
Published in: IEEE Transactions on Reliability ( Volume: 43, Issue: 2, June 1994)
Page(s): 186 - 192
Date of Publication: 30 June 1994

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