Abstract:
Physical models are presented for single- and multi-wall carbon nanotubes. The models are used to quantify the performance enhancements that they can potentially offer if...Show MoreMetadata
Abstract:
Physical models are presented for single- and multi-wall carbon nanotubes. The models are used to quantify the performance enhancements that they can potentially offer if used as interconnects in GSI chips. For short lengths, mono-layer SWCN interconnects can lower capacitance by 50% whereas for long lengths SWCN-bundles can improve conductivity up to 100%. Conductivity of MWCNs increases with diameter if they are longer than a critical length of about 7 mum and decreases otherwise
Published in: 2006 International Interconnect Technology Conference
Date of Conference: 05-07 June 2006
Date Added to IEEE Xplore: 05 July 2006
Print ISBN:1-4244-0104-6
ISSN Information:
Keywords assist with retrieval of results and provide a means to discovering other relevant content. Learn more.
- IEEE Keywords
- Index Terms
- Low Capacity ,
- Carbon Nanotubes ,
- Specific Strength ,
- Multi-walled Carbon Nanotubes ,
- Single-walled Carbon Nanotubes ,
- Impedance ,
- Cross-sectional Area ,
- Aspect Ratio ,
- Small Diameter ,
- Thermal Energy ,
- Grain Boundaries ,
- Equivalent Circuit ,
- Contact Resistance ,
- Outer Shell ,
- Mean Free Path ,
- Copper Wire ,
- Inner Shell ,
- Surface Scattering ,
- Quantized Conductance
Keywords assist with retrieval of results and provide a means to discovering other relevant content. Learn more.
- IEEE Keywords
- Index Terms
- Low Capacity ,
- Carbon Nanotubes ,
- Specific Strength ,
- Multi-walled Carbon Nanotubes ,
- Single-walled Carbon Nanotubes ,
- Impedance ,
- Cross-sectional Area ,
- Aspect Ratio ,
- Small Diameter ,
- Thermal Energy ,
- Grain Boundaries ,
- Equivalent Circuit ,
- Contact Resistance ,
- Outer Shell ,
- Mean Free Path ,
- Copper Wire ,
- Inner Shell ,
- Surface Scattering ,
- Quantized Conductance