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Latch-up failure path between power pins in the mixed-voltage process | IEEE Conference Publication | IEEE Xplore

Latch-up failure path between power pins in the mixed-voltage process


Abstract:

A new latch-up failure phenomenon induced by the parasitic P-N-P-N path between power pins is reported here. This latch-up failure is observed in 0.13/spl mu/m and 0.18/s...Show More

Abstract:

A new latch-up failure phenomenon induced by the parasitic P-N-P-N path between power pins is reported here. This latch-up failure is observed in 0.13/spl mu/m and 0.18/spl mu/m process, but the test passes in 0.25/spl mu/m. a traditional latch-up prevention methodology of guide-ring insertion works well here, and the chip is tape-out.
Date of Conference: 20-23 October 2003
Date Added to IEEE Xplore: 13 April 2004
Print ISBN:0-7803-8157-2
Conference Location: Lake Tahoe, CA, USA

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