Abstract:
Health-monitoring systems often integrate sensory interfaces with passive telemetry to create wireless and untethered continuous real-time diagnostic functions. Despite t...Show MoreMetadata
Abstract:
Health-monitoring systems often integrate sensory interfaces with passive telemetry to create wireless and untethered continuous real-time diagnostic functions. Despite the circuit simplicity and miniaturization with this topology, traditional packaging approach with surface-mount components creates a major barrier toward miniaturization and signal quality. To address this, the embedded and passive neural recording telemetry systems are fabricated with three key technical features: 1) passive telemetry to achieve zero-power neural recording; 2) 3-D-printed package; and 3) embedded components inside the package. Nanopackaging with 3-D printing of silver and epoxy is utilized to create cavities for embedding diodes. This additive code position is also effectively utilized to embed multilayered film capacitors to enable unique 3-D designs. The fully embedded and miniaturized system achieves higher sideband neural power by an additional 5 dB compared to that of discrete components, which directly implies higher signal sensitivity. The resulting miniaturized recording unit of 8.2 × 8.5 × 1 mm3 is capable of wireless acquisition with signal strengths as low as 160 μVpp. This novel approach of fully embedded components in package build-up layers will eventually lead to future chip-scale systems with enhanced performance and reliability.
Published in: IEEE Sensors Journal ( Volume: 25, Issue: 2, 15 January 2025)