Ferroelectric Transistor-Based Synaptic Crossbar Arrays: The Impact of Ferroelectric Thickness and Device-Circuit Interactions

Ferroelectric transistors (FeFETs)-based crossbar arrays have shown immense promise for computing-in-memory (CiM) architectures targeted for neural accelerator designs. Offering CMOS compatibility, nonvolatility, compact bit cell, and CiM-amenable features, such as multilevel storage and voltage-driven conductance tuning, FeFETs are among the foremost candidates for synaptic devices. However, device and circuit nonideal attributes in FeFETs-based crossbar arrays cause the output currents to deviate from the expected value, which can induce error in CiM of matrix-vector multiplications (MVMs). In this article, we analyze the impact of ferroelectric thickness (
$T_{\text {FE}}$
) and cross-layer interactions in FeFETs-based synaptic crossbar arrays accounting for device-circuit nonidealities. First, based on a physics-based model of multidomain FeFETs calibrated to experiments, we analyze the impact of
$T_{\text {FE}}$
on the characteristics of FeFETs as synaptic devices, highlighting the connections between the multidomain physics and the synaptic attributes. Based on this analysis, we investigate the impact of
$T_{\text {FE}}$
in conjunction with other design parameters, such as number of bits stored per device (bit slice), wordline (WL) activation schemes, and FeFETs width on the error probability, area, energy, and latency of CiM at the array level. Our results show that FeFETs with
$T_{\text {FE}}$
around 7 nm achieve the highest CiM robustness, while FeFETs with
$T_{\text {FE}}$
around 10 nm offer the lowest CiM energy and latency. While the CiM robustness for bit slice 2 is less than bit slice 1, its robustness can be brought to a target level via additional design techniques, such as partial wordline activation and optimization of FeFETs width.