Package Assembly Design Kits (PADK's)- The Future of Advanced Wafer-Level Manufacturing

Process design kits (PDKs) are well-known catalysts in integrated circuit (IC) design. However, they are still a new concept to the packaging world and many packaging engineers do not understand their importance in the success of IC designs. Traditionally, packaging companies provide only a copy of their design rules, which tend to be very dynamic. This approach creates unnecessary delays and back-and-forth design iterations between the package designer and the High-Density Fan-Out (HDFO) package manufacturer in HDFO applications. Although package design and IC design are two different worlds, they share several key similarities that have contributed to the successful use of Package Assembly Design Kits (PADKs). By using PADKs, designers can significantly increase productivity, reduce cycle times, and limit the number of design iterations in HDFO applications. Attendees of this session can expect to gain a broader understanding of how PADKs can help them achieve their goals by attending this session. The design layout and system-level performance of an HDFO require a variety of dynamic design rule definitions. To capture and implement these design rule constraints, PADKs must be used. These PADKs provide a unique type of implementation by validating the design layout with a benchmark that supports the manufacturing and assembly processes used by the manufacturer. When managing a digital supply chain, it is crucial to choose a manufacturer with significant expertise in PADKs. Amkor has been a trailblazer in developing Package Assembly Design Kits since 2016. By partnering with Amkor, businesses can receive PADK support and make them a valuable member of their device development team. Advanced wafer-level manufacturers can offer guidance on package design layout, provide specialized application training, and offer continuous design review support. Advanced wafer-level manufacturers like Amkor use the latest software to integrate their packaging knowledge and experience into PADK elements. Collaborating with an experienced advanced wafer-level manufacturer and utilizing PADKs from the inception of package design development is crucial to reduce the number of design layout changes required to meet manufacturing and assembly best practices. With the increase in HDFO signal I/O counts, the only practical solution is to incorporate a PADK to drive the package design layout from the very beginning. Integrating a PADK into an existing design workflow may entail some investment but the benefits can be exponential, with sequential or parallel projects being initiated. The areas requiring investment will depend on the current design environment and established workflows. There are four pillars that lead to a successful PADK implementation: high-end computer hardware, compatible software, advanced training, and a qualified support team. The scale of each will depend on the scope of each package being developed. One significant advantage of the Package Assembly Design Kit elements is that each item can be integrated into existing design flows with minimal impact on the design process but with significant results. Bringing together all the benefits is like opening doors into tomorrow, and they remain open with the potential and opportunities offered by ongoing advancements in Package Assembly Design Kits.