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Research on linear active disturbance rejection synchronous control of gantry moving platform | IEEE Conference Publication | IEEE Xplore

Research on linear active disturbance rejection synchronous control of gantry moving platform


Abstract:

In the rapidly developing microelectronics packaging industry, the demand for high-speed and high-precision equipment is becoming more and more urgent. Gantry motion plat...Show More

Abstract:

In the rapidly developing microelectronics packaging industry, the demand for high-speed and high-precision equipment is becoming more and more urgent. Gantry motion platform has been widely used in the field of chip packaging because of its excellent performance. However, the platform faces a key challenge, namely the mechanical coupling between linear motors, which affects positioning accuracy and synchronization performance. In order to solve this problem, the linear active disturbance rejection controller (LADRC) is introduced in this study, which is a simplified version of the active disturbance rejection controller and has received much attention because of its easy parameter adjustment. It is suggested to combine the cross-coupling synchronization algorithm with the control method based on LADRC to optimize the gantry platform servo system. In order to further improve the response speed of the platform, a feedforward controller (FFC) is also added in the study. In addition, the linear extended state observer (LESO) is used to monitor the dynamic changes and disturbances of the system, and the corresponding compensation is made, which improves the anti-interference ability and stability of the servo system. The simulation model of gantry movement platform control system is established, and the effectiveness of LADRC strategy is verified. The results show that LADRC combined with feedforward compensation is superior to PID control in terms of reaction speed, anti-interference ability and synchronous tracking, and can meet the requirements of high speed and high precision in microelectronics packaging industry.
Date of Conference: 07-09 August 2024
Date Added to IEEE Xplore: 23 September 2024
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Conference Location: Tianjin, China

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