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Reduction of Medical Device Heating During Mri At 1.5 T and 3 T: Design and Experimental Validation of A New Lead Construct | IEEE Conference Publication | IEEE Xplore

Reduction of Medical Device Heating During Mri At 1.5 T and 3 T: Design and Experimental Validation of A New Lead Construct


Abstract:

Radiofrequency induced (RF) heating of extended wires during magnetic resonance imaging (MRI) poses a safety risk for patients with active electronic implants. Previous r...Show More

Abstract:

Radiofrequency induced (RF) heating of extended wires during magnetic resonance imaging (MRI) poses a safety risk for patients with active electronic implants. Previous research has demonstrated that strategically incorporating multiple discrete conductivity changes along the wire’s length can mitigate heating at its tip. This study presents simulations for a realistically sized multi-segment lead and describes the design, construction, and experimental heating testing of physical prototype leads. Initial simulation indicated potential for a 6-fold reduction in heating at 1.5 T and a 4-fold reduction at 3 T. Experimental testing ultimately revealed a 7-fold reduction in temperature rise during MRI at 1.5 T and a 2-fold reduction at 3 T.
Date of Conference: 27-30 May 2024
Date Added to IEEE Xplore: 22 August 2024
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Conference Location: Athens, Greece

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