In-Mold Heat Radiating Simulation and Verification of In-Mold Electronics

In-mold electronics can reduce deformation by integrating multiple components and encapsulating them with plastic injection molding. However, complex components and electronic functional films can cause heat concentration problems. We used an in-mold radiating structure to heat-dissipating from electronic devices, and thermal simulation analysis was used to model the structure and process, and the results showed that local contact with heat-dissipating ink can effectively reduce heat energy by 25%. SMD LED components with plastic injection molding can increase thermal energy by 36%. Proper heat dissipation structures and sealing with plastic injection molding can effectively discharge heat energy, but if the heat-dissipating structure in contact with the heat source does not match, the temperature can reach 154.2°C, causing the LED to malfunction.