Power Delivery Network and Integrity in 3D‐IC Chips

Summary

This chapter overviews the electronic properties of a power delivery network (PDN) of integrated circuit (IC) chips, involving interactions with packages and printed circuit boards associated with system‐level assembly. The closer looks are provided for frequency‐domain impedance of a PDN with resonating peaks and how they are altered mainly by intentional decoupling capacitors and parasitic inductive components. The understandings are mainly given for conventional 2D‐IC chips while extended for 2.5D and 3D constructions.