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On the Thermal Management of 3D‐ICs: From Backside to Volumetric Heat Removal | part of Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management | Wiley Semiconductors books | IEEE Xplore

On the Thermal Management of 3D‐ICs: From Backside to Volumetric Heat Removal

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Chapter Abstract:

Summary This chapter presents various novel heat removal approaches to compile a roadmap toward true 3D integration. A topology change from single side to dual side and v...Show More

Chapter Abstract:

Summary

This chapter presents various novel heat removal approaches to compile a roadmap toward true 3D integration. A topology change from single side to dual side and volumetric heat removal is a more disruptive option to reduce the thermal constraints on 3D chip stacks. Designing a thermal underfill is a multivariable problem with targets for mechanical, thermomechanical, and electrical properties, besides thermal aspects. Therefore, the complete set of properties needs to be studied in order to guide the experimental work regarding the choice of materials and geometries. Effective properties of percolating and neck‐based thermal underfills can be computed using finite element methods. Bringing a liquid coolant closer to the heat source changes the package topology. The chapter overviews the consequences of such a topology change. Using liquid coolant within the package relaxes the thermal requirements on some package parts ‐ such as rendering Cu lids obsolete ‐ but adds requirements on loads, sealing, replaceability, and reliability.

Page(s): 433 - 460
Copyright Year: 2019
Edition: 1
ISBN Information: