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Up-and-Down Adjustment of the GaAs Loss Tangent Using Extreme Power Densities in a Subterahertz Cavity | IEEE Journals & Magazine | IEEE Xplore

Up-and-Down Adjustment of the GaAs Loss Tangent Using Extreme Power Densities in a Subterahertz Cavity


Abstract:

We study variations in the dielectric properties of a semi-insulating Gallium arsenide (GaAs) wafer under millisecond pulses of extreme subterahertz power density of up t...Show More

Abstract:

We study variations in the dielectric properties of a semi-insulating Gallium arsenide (GaAs) wafer under millisecond pulses of extreme subterahertz power density of up to 180 kW/mm2 at 263 GHz. Increasing the duration and power of the pulse, we have obtained sequential down- and upshifts within the range of more than two orders in the effective loss tangent of the wafer in experiments. We have observed the existence of an optimal regime of subterahertz irradiation, in which the accurate, simple and selective annealing of the wafer from the 300 nanometer-thick surface layer of oxides is achieved, even in plain air, without a damage to pure GaAs. An finite-difference time-domain-based numerical simulation explains such selectivity with a difference in tangent losses of about 25 times between pure GaAs and its impurities in the subterahertz band.
Published in: IEEE Transactions on Terahertz Science and Technology ( Volume: 14, Issue: 4, July 2024)
Page(s): 537 - 542
Date of Publication: 18 April 2024

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I. Introduction

Semi-insulating Gallium arsenide (GaAs), or pure GaAs without doping has become widespread among rapid switching devices [1], [2], [3], [4] in subterahertz bands. The main advantages of GaAs over other semiconductors are: the nanosecond duration of photoconductivity relaxation, the high breakdown threshold, and the low losses in the terahertz bands. Under room conditions in open air, the surface of pure GaAs is covered with a thin native film of oxides and hydroxides [5]. The film is usually harmful for semiconductor devices, as its physics, still being typical for a semiconductor, differs from that of the pure GaAs. The oxide layer generally increases the effective tangent loss, making it much higher than one for a pure medium. There are several methods of treating the film, in particular, thermal annealing [5], [6], chemical dissolving [7], [8], or deoxidation by chemical reactions [9], [10]. All of the known methods have some drawbacks, from lattice defects and unpredictable geometry of the resulting surface to the requirements of vacuum or additional chemicals. In this research, we study the recently discovered phenomenon of enhancement of resonant characteristics in a GaAs-based microscopic resonator cavity under excitation by pulsed powerful subterahertz radiation [11]. The rest of this article is organized as follows. This study covers experimental phenomena of oxide removal using subterahertz radiation in Section II, microscopic investigations of the wafer in the different stages of the experiment in Section III, a simplified theory of thermal distribution within the wafer inside the electro-magnetic resonator cavity in Section IV, and its comparison to the experiment in Section V. Finally, Section VI concludes this article.

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