Fan-Out Embedded Bridge Solution for Chiplet/HBM Integration

This paper will provide an overview of memory integration evolution trends seen in the industry across different package platform, including memory on PCB, in SiP and in chip module. From viewpoint of electrical/ stress and CM warpage performance, It figured out major advantage of FO-EB (Embedded Bridge) and FO-EB-T (w/ TSV) with HBM integration respectively compared to 2.5D platform. At the same time, we also exhibited chip module bonding guide-line according to methodology benchmark between traditional DB/MR and TCB process. Finally, under larger CM size and TCB adoption, FO-EB-T package level reliability w/ HBM integration also be demonstrated successfully.