Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test

Compared to the experimental investigations, finite element method-based simulation techniques speed up the design optimization and life cycle assessment of high-tech components during the development. Furthermore, the costs of manufacturing the prototypes are saved when developing in the virtual environment. However, modern multiphysics industrial models usually lead to high computational costs and the generated data may exceed the capacity of the computer. Therefore, in this work, aiming at the efficient simulation of a strongly coupled thermo-mechanical packaged chip model, we generate a highly accurate reduced-order model via the mathematical method of model order reduction. Such a surrogate can be used for simultaneous temperature cycling and vibration tests at the system level.