Laser Direct Structuring (LDS) for enhanced QFN package

Flexibility, speed, and reliability made wire bonding the most used technology in integrated circuit packaging. On the other hand, thermomechanical stress at process level and thermal efficiency and parasitic at operating life level, represent the main wire bonding challenges. In this paper, a new package solution is proposed to overcome wire bonding limitations. Inspired by Molded Interconnect Devices (MID) technology, conductive paths can be produced on the surface of specific molding compound blend creating electrical links between device and leadframe. Front End device customization, Back End innovative assembly process flow, Electrical Wafer Sorting design and simulation results are described in addition to electrical response benefits.