13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Power TSV and a 6-Phase RDQS Scheme for TSV Area Optimization

With the emergence of large-language models (LLM) and generative AI, which require an enormous amount of model parameters, the required memory bandwidth and capacity for high-end systems is on an unprecedented increase. To meet this need, we present an extended version of the high-bandwidth memory-3 (HBM3 DRAM), HBM3E, which achieves a 1280GB/s bandwidth with a cube density of 48GB. New design schemes and features, such as all-around power-through-silicon via (TSV), a 6-phase read-data-strobe (RDQS) scheme, a byte-mapping swap scheme, and a voltage-drift compensator for write data strobe (WDQS), are implemented to achieve extended bandwidth and capacity with enhanced reliability. The overall architecture and specifications, such as bump map footprint, the number of channel and I/Os, and the operation voltage, are identical to the latest HBM3 [1, 2]; therefore, backward compatibility is provided, avoiding system modification.

With the emergence of large-language models (LLM) and generative AI, which require an enormous amount of model parameters, the required memory bandwidth and capacity for high-end systems is on an unprecedented increase. To meet this need, we present an extended version of the high-bandwidth memory-3 (HBM3 DRAM), HBM3E, which achieves a 1280GB/s bandwidth with a cube density of 48GB. New design schemes and features, such as all-around power-through-silicon via (TSV), a 6-phase read-data-strobe (RDQS) scheme, a byte-mapping swap scheme, and a voltage-drift compensator for write data strobe (WDQS), are implemented to achieve extended bandwidth and capacity with enhanced reliability. The overall architecture and specifications, such as bump map footprint, the number of channel and I/Os, and the operation voltage, are identical to the latest HBM3 [1, 2]; therefore, backward compatibility is provided, avoiding system modification.