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High-Efficient Silicon Microring Modulator of 3D Omni-Junction Profile | IEEE Conference Publication | IEEE Xplore

High-Efficient Silicon Microring Modulator of 3D Omni-Junction Profile


Abstract:

Doping profiles have significantly affected the trade-off of modulator performance. The optimization of doping has been limited by the compact rib waveguide, which leads ...Show More

Abstract:

Doping profiles have significantly affected the trade-off of modulator performance. The optimization of doping has been limited by the compact rib waveguide, which leads to thoughts of introducing another doping dimension, namely the optical propagation direction, thus realizing 3D optimization. A silicon microring modulator composed of V-shaped and L-shaped junctions is demonstrated with \mathrm{V}_{\pi}\mathrm{L} of 0.78 V.cm and bandwidth over 28.1 GHz. Results demonstrate the feasibility of complex 3D doping profiles for high-speed applications.
Date of Conference: 04-07 November 2023
Date Added to IEEE Xplore: 01 January 2024
ISBN Information:
Conference Location: Wuhan, China

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