Design and Analysis of Microsystem SiP for on-Board Embedded Computer

The miniaturization and lightweight requirements faced by OBCs (on-board control computers) are becoming increasingly urgent. As high-density packaging method, System in Package (SiP) is able to compress multiple functions into smaller external dimensions, conforming to high integration and high performance requirements of military electronics. Aiming at the demand for high-density, high-performance and miniaturization of components used in spacecraft, an embedded microcomputer SiP for aerospace applications has been designed in this paper. System design and layout design of the SiP is introduced. Electrical, thermal, and mechanical simulations have been conducted to ensure design rationality and design reliability, and the simulation results shows that the SiP satisfy all the requirements for orbit flight. The outline dimension of the SiP is only 31mm*31mm*10mm, and the weight of overall module is about 20g. Compared to PCB design, the volume and weight are reduced by 70%. The embedded microcomputer SiP satisfies the performance requirements and size requirements of onboard computers.