Fundamentals, Commercialization, and Future Challenges of SiC Power Devices | IEEE Conference Publication | IEEE Xplore

Fundamentals, Commercialization, and Future Challenges of SiC Power Devices


Abstract:

High-voltage SiC power MOSFETs and Schottky barrier diodes have been rapidly penetrating the power electronics market owing to their low power loss and fast-switching cap...Show More

Abstract:

High-voltage SiC power MOSFETs and Schottky barrier diodes have been rapidly penetrating the power electronics market owing to their low power loss and fast-switching capability. In this paper, fundamental aspects and progress in SiC devices are reviewed. Although SiC power MOSFETs significantly outperform the Si counterparts, the performance is still far from the ideal expected from the material properties. Improvement of device reliability such as threshold voltage instability and short-circuit ruggedness is another critical issue for wider adoption of SiC MOSFETs.
Date of Conference: 16-17 November 2023
Date Added to IEEE Xplore: 25 December 2023
ISBN Information:

ISSN Information:

Conference Location: Kyoto, Japan

Contact IEEE to Subscribe

References

References is not available for this document.