Extending DRSEM Inspection Capacities and Applications with the Introduction of D2DB Technology

The rapid evolution of semiconductor process technologies has made defect detection using Defect Review Scanning Electron Microscopy (DRSEM) increasingly challenging, especially for defects in complex patterned regions. By integrating design layout data into the detection process, we have enhanced DRSEM's defect detectability and expanded its applications. The D2DB technology allows for accurate detection of systematic defects within patterned areas. In addition, it aids in identifying various soft defects and those arising from pattern drift. The technique's target recognition capability also facilitates direct monitoring of CD variations and hotspot verification by combining SEM review results with design layout checks.

I. Introduction

DRSEM is important in semiconductor manufacturing, aiding fabs in defect monitoring and source tracing[1]. However, with the progression of semiconductor technology and the increasing complexity of chip designs, DRSEM confronts substantial challenges in effectively identifying defects within these intricate patterns [2].