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Extending DRSEM Inspection Capacities and Applications with the Introduction of D2DB Technology | IEEE Conference Publication | IEEE Xplore
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Extending DRSEM Inspection Capacities and Applications with the Introduction of D2DB Technology


Abstract:

The rapid evolution of semiconductor process technologies has made defect detection using Defect Review Scanning Electron Microscopy (DRSEM) increasingly challenging, esp...Show More

Abstract:

The rapid evolution of semiconductor process technologies has made defect detection using Defect Review Scanning Electron Microscopy (DRSEM) increasingly challenging, especially for defects in complex patterned regions. By integrating design layout data into the detection process, we have enhanced DRSEM's defect detectability and expanded its applications. The D2DB technology allows for accurate detection of systematic defects within patterned areas. In addition, it aids in identifying various soft defects and those arising from pattern drift. The technique's target recognition capability also facilitates direct monitoring of CD variations and hotspot verification by combining SEM review results with design layout checks.
Date of Conference: 26-27 October 2023
Date Added to IEEE Xplore: 01 January 2024
ISBN Information:
Conference Location: Lishui, Zhejiang Province, China

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