Mobilint’s ARIES: Chip for Edge AI | IEEE Conference Publication | IEEE Xplore

Mobilint’s ARIES: Chip for Edge AI


Abstract:

The advancement of AI technology has led to its widespread adoption in a variety of fields. However, in the edge environment, there is currently no AI chip that effective...Show More

Abstract:

The advancement of AI technology has led to its widespread adoption in a variety of fields. However, in the edge environment, there is currently no AI chip that effectively meets the market’s demands for performance, power efficiency, and price. As a result, AI applications have not been fully realized in edge contexts. To address this gap, we present ARIES, an innovative AI chip developed by Mobilint, a fabless company headquartered in South Korea. ARIES embodies superior performance, high power efficiency, and competitive pricing. Mobilint offers ARIES in two distinct forms: the PCIe card MLA100 and the AI box MLX-A1, each designed to maximize utility. To further enhance user engagement, a user-friendly software development kit (SDK) named qb is also provided to simplify deployment.
Date of Conference: 23-25 October 2023
Date Added to IEEE Xplore: 27 November 2023
ISBN Information:
Conference Location: Busan, Korea, Republic of

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