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Human Activity Recognition SoC for AR/VR with Integrated Neural Sensing, AI Classifier and Chained Infrared Communication for Multi-chip Collaboration | IEEE Conference Publication | IEEE Xplore

Human Activity Recognition SoC for AR/VR with Integrated Neural Sensing, AI Classifier and Chained Infrared Communication for Multi-chip Collaboration


Abstract:

This paper presents a distributed multi-chip human activity recognition system for Virtual Reality (VR) and Augmented Reality (AR) applications. A comprehensive solution ...Show More

Abstract:

This paper presents a distributed multi-chip human activity recognition system for Virtual Reality (VR) and Augmented Reality (AR) applications. A comprehensive solution is delivered including AI core for classification, analog sensing for neural activity detection and infrared data communication for multi-chip collaboration. A 65\mathrm{~nm} test chip is fabricated and distributed across the body area to demonstrate the low power, low latency, and camera-free features of the target applications.
Date of Conference: 11-16 June 2023
Date Added to IEEE Xplore: 24 July 2023
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Conference Location: Kyoto, Japan

Funding Agency:

Northwestern University, Evanston, IL, USA
Northwestern University, Evanston, IL, USA
Northwestern University, Evanston, IL, USA

Northwestern University, Evanston, IL, USA
Northwestern University, Evanston, IL, USA
Northwestern University, Evanston, IL, USA

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