Manifold Integrated Cold Plate for Single-Phase and Two-Phase Liquid Cooling

Liquid cooling is the trend for data center cooling with the increasing power for both server CPU(Center Processor Unit)/GPU(Graphic Processor Unit)/AI(Artificial Intelligence) chips and non-CPU components driven by the performance need for HPC(High Performance Computing), AI, and high-end application. The cold plate based liquid cooling is the primary solution technical path for liquid cooling of data centers. Inside these types of cold plate designs, the cold plate solution with both straight or patterned fins are fabricated using machining or skiving process between the inlet and outlet and liquid flows. The existing design has disadvantage of fluid preheating effect, especially for Multiple Chip Package (MCP). This paper introduces a novel cold plate fin design with patent filed as called “manifold integrated cold plate” design which can be used for both single-phase and two-phase cold plate. With the manifold integrated design, the cold liquid from the inlet can be evenly distributed to all patterned fins across the whole cold plate. The temperature distribution in the cold plate can be significantly improved. The thermal simulation results show die temperature gradient in MCP is improved from 25C to 14C. The prototype of single-phase cold plates are also verified to prove the benefit of 28% of thermal performance and 60% of pressure drop improvement compared with the existing reference cold plate design. This paper demonstrates the new cold plate flow channels management to enhance the cold plate thermal performance and flow impedance improvement for single/two-phase cold plate liquid cooling system.