Top-Side Cooling Packages: Disrupting Technology to BoostPower Density and Performance in High-End Power ConversionSystems | VDE Conference Publication | IEEE Xplore

Top-Side Cooling Packages: Disrupting Technology to BoostPower Density and Performance in High-End Power ConversionSystems

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Abstract:

This paper analyzes the thermal performance of silicon MOSFETs housed in surface-mount (SMD) packages both with top-side and bottom-side cooling. Using a mathematical met...Show More

Abstract:

This paper analyzes the thermal performance of silicon MOSFETs housed in surface-mount (SMD) packages both with top-side and bottom-side cooling. Using a mathematical method to estimate the power losses and thermal simulations, we demonstrate how the top-side cooling thermal dissipation approach can help reduce the junction temperature and lower the power losses thanks to a smoother variation, caused by temperature changes, of the main silicon MOSFET parameters, such as RDS(on) and Vth level.
Date of Conference: 09-11 May 2023
Date Added to IEEE Xplore: 04 July 2023
Print ISBN:978-3-8007-6091-6
Conference Location: Nuremberg, Germany

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