Abstract:
This paper analyzes the thermal performance of silicon MOSFETs housed in surface-mount (SMD) packages both with top-side and bottom-side cooling. Using a mathematical met...Show MoreMetadata
Abstract:
This paper analyzes the thermal performance of silicon MOSFETs housed in surface-mount (SMD) packages both with top-side and bottom-side cooling. Using a mathematical method to estimate the power losses and thermal simulations, we demonstrate how the top-side cooling thermal dissipation approach can help reduce the junction temperature and lower the power losses thanks to a smoother variation, caused by temperature changes, of the main silicon MOSFET parameters, such as RDS(on) and Vth level.
Date of Conference: 09-11 May 2023
Date Added to IEEE Xplore: 04 July 2023
Print ISBN:978-3-8007-6091-6