Reliability of pressure contacted intelligent integrated power modules

The pressure contact concept offers new opportunities for an advanced power module package technology. It is flexible with respect to the substrate size or material and it enables progress in system architecture by integration of intelligence and additional functions. The reliability of the pressure contact module is superior to the state-of-the-art base plate module. The load cycle lifetime exceeds the data known for base plate modules and improves the predictability due to a defined end-of-life limit.