I. Introduction
Holistic enterprise infrastructure from cloud to data centers coupled with intelligent edge computing utilizing 5G and AI has driven semiconductor industry growth in the recent years (1,2). The increasing amount of data from all sectors is raising a problem of operational and storing cost of the data (3, 4). As Moore’s law continues to challenge the foundry companies to increase transistor density, the exponential cost of silicon scaling has created an inflection point for the industry. It has driven the development of More-Than-Moore to augment increased device and system performance. Chiplet or die partitioning has gained momentum as an alternative to monolithic SoC development that allow to mix-and-match with separate designs and different manufacturing process nodes, to reuse IPs, to improve process yield, to optimize the performance and to reduce the cost and time to market. Chiplets and heterogeneous integration through the advanced packaging technology have provided advancement for more intelligence, greater connectivity, and higher performance at a more manageable cost.