Abstract:
A new boundary element formulation is presented for the electromagnetic analysis of interconnects in layered media, which accurately captures skin effect in conductors of...Show MoreMetadata
Abstract:
A new boundary element formulation is presented for the electromagnetic analysis of interconnects in layered media, which accurately captures skin effect in conductors of arbitrary shape and size. Results show superior CPU-time and memory performance compared to several state-of-the-art techniques.
Published in: 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Date of Conference: 05-07 October 2020
Date Added to IEEE Xplore: 20 October 2020
ISBN Information: