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52 km-Long Transmission Link Using a 50 Gb/s O-Band Silicon Microring Modulator Co-Packaged With a 1V-CMOS Driver | IEEE Journals & Magazine | IEEE Xplore

52 km-Long Transmission Link Using a 50 Gb/s O-Band Silicon Microring Modulator Co-Packaged With a 1V-CMOS Driver


Impact Statement:In this paper, we demonstrate a co-packaged O-band Micro-ring modulator based transmitter assembly with an 1V driver exhibiting a record-high bandwidth-distance product o...Show More

Abstract:

We present an O-band silicon microring modulator with up to 50 Gb/s modulation rates, co-packaged with a 1V-CMOS driver in a dispersion un-compensated, transmission exper...Show More
Impact Statement:
In this paper, we demonstrate a co-packaged O-band Micro-ring modulator based transmitter assembly with an 1V driver exhibiting a record-high bandwidth-distance product of 2600Gb-km/s, by operating at 50Gb/s OOK in a dispersion uncompensated 52km SSMF link. The device leverages the low dispersion of SSMF in the O-band and the low power credentials of an 1V MRM driver, to overcome the maximum dispersion uncompensated transmission distance, and high-power requirements of previous demonstrations.

Abstract:

We present an O-band silicon microring modulator with up to 50 Gb/s modulation rates, co-packaged with a 1V-CMOS driver in a dispersion un-compensated, transmission experiment through 52 km of standard single-mode fiber. The experimental results show 10-9 error-rate operation with a negligible power penalty of 0.2 dB for 40 Gb/s and wide-open eye diagrams for 50 Gb/s data, corresponding to a record high bandwidth-distance product of 2600 Gb·km/s. A comparative analysis between the proposed transmitter assembly and a commercial LiNbO3 modulator revealed a moderate increase of 3.8 dB in power penalty, requiring only 20% of the driving voltage level used by the commercial modulator.
Published in: IEEE Photonics Journal ( Volume: 11, Issue: 4, August 2019)
Article Sequence Number: 7903907
Date of Publication: 07 June 2019

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