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Analysis of Cu-Graphene Interconnects | IEEE Journals & Magazine | IEEE Xplore

Analysis of Cu-Graphene Interconnects


Schematic of Cu-graphene interconnect.

Abstract:

Due to its ultrathin feature, graphene has been recently proposed as diffusion barrier layer for Cu wires. This paper is geared toward developing an equivalent single-con...Show More

Abstract:

Due to its ultrathin feature, graphene has been recently proposed as diffusion barrier layer for Cu wires. This paper is geared toward developing an equivalent single-conductor (ESC) transmission-line (TL) model for analysis of Cu-graphene interconnects, i.e., Cu wires encapsulated with graphene barriers. Based on the ESC TL model, electrical performances of Cu-graphene interconnects are examined and evaluated. It is shown that the time delay and temperature rise can be reduced by replacing the conventional diffusion barriers in the Cu/low-k interconnect with the graphene barriers.
Schematic of Cu-graphene interconnect.
Published in: IEEE Access ( Volume: 6)
Page(s): 53499 - 53508
Date of Publication: 10 September 2018
Electronic ISSN: 2169-3536

Funding Agency:


References

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