Characterization and analysis of Transistor Outline TO-254 package for power device applications

The vast advancements in Semiconductor Power Devices has led to increased deliberations in packaging of these devices. Primary among them are single IC stand alone systems. This paper considers TO-254 packaging for power devices. We observe the behavior of the specimen under different conditions mimicking the different environment exposed in the lifecycle of the device. Insulation Resistance, Breakdown Strength and other electronic properties are deliberated on.