Abstract:
In this paper, a novel petaloid hollow Cu interconnection for interposer is presented, its stress can be released by free ends face to hollow Cu interconnection center, a...Show MoreMetadata
Abstract:
In this paper, a novel petaloid hollow Cu interconnection for interposer is presented, its stress can be released by free ends face to hollow Cu interconnection center, and its fabrication process for Si substrate and glass substrate are also presented. Stress distribution and Max. stress of interposer with petaloid hollow Cu interconnection comparison with normal TSV is simulated and analyzed by thermal-mechanical model. Typical electrical path composed of petaloid hollow Cu interconnection is modeled, coupling influences of structure changing and thermal vibration on its electrical property is analyzed.
Date of Conference: 16-19 August 2016
Date Added to IEEE Xplore: 06 October 2016
ISBN Information: