Abstract:
Advanced SEM/SPM microscopy will expand the application fields in failure analysis and reliability investigation, because the recognition of defects and their subsequent ...Show MoreMetadata
Abstract:
Advanced SEM/SPM microscopy will expand the application fields in failure analysis and reliability investigation, because the recognition of defects and their subsequent characterization have to be carried out with highest spatial resolution to ensure that even smallest structures with modified material properties can be evaluated. Promising for future applications is the fact that the used probes simultaneously can either be used as sensors, giving access to a vast variety of material properties, or as actuators, which can deliberately modify samples properties.
Published in: 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
Date of Conference: 02-06 July 2012
Date Added to IEEE Xplore: 20 September 2012
ISBN Information:
Contents 