Thermoelastic Dissipation in Etch-Hole Filled Lamé Bulk-Mode Silicon Microresonators | IEEE Journals & Magazine | IEEE Xplore

Thermoelastic Dissipation in Etch-Hole Filled Lamé Bulk-Mode Silicon Microresonators


Abstract:

The perforation of a Lamé bulk-mode silicon mechanical resonator via uniformly distributed etch holes has been observed to drastically reduce the quality factor by over 9...Show More

Abstract:

The perforation of a Lamé bulk-mode silicon mechanical resonator via uniformly distributed etch holes has been observed to drastically reduce the quality factor by over 90%. The cause of this sharp drop remains largely unknown. A high is important, while etch holes are commonly used in the fabrication of resonators. This letter traces the cause to thermoelastic dissipation through the use of finite-element analysis based on coupled thermoelastic equations. The results from the analysis are well corroborated by data from measurements of fabricated silicon-on-insulator devices.
Published in: IEEE Electron Device Letters ( Volume: 33, Issue: 3, March 2012)
Page(s): 450 - 452
Date of Publication: 01 February 2012

ISSN Information:


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