Abstract:
In this paper we present a fully integrated, high yielding, high reliability DC contact microelectromechanical systems (MEMS) switch technology. A high voltage double-dif...Show MoreMetadata
Abstract:
In this paper we present a fully integrated, high yielding, high reliability DC contact microelectromechanical systems (MEMS) switch technology. A high voltage double-diffused metal-oxide-semiconductor (DMOS) driver application-specific integrated circuit (ASIC) is co-packaged with a single-pole-four-throw (SP4T) DC contact MEMS switch in a 5×4×1mm 24-pin quad flat no leads (QFN) plastic package. The MEMS switch process yields >90% on 6 inch wafers and plastic package devices have been subjected to standard IC qualification testing as well as MEMS switch specific lifetime testing over −40°C to 85°C with industry leading results. The MEMS switch is actuated with 80V generated by the control ASIC and exhibits cycle lifetime of > 3 Billion (3×109) cycles when toggled at 5 kHz. The switches are targeted at radio frequency (RF) switching applications and have insertion loss/isolation of 0.4dB/25dB at 6 GHz. Key challenges overcome were, design of the MEMS switch to ensure high yield and reliability, low thermal sensitivity under the influence of the packaging process, optimization of the contact system, and design of the actuation waveform to enhance lifetime.
Published in: SENSORS, 2011 IEEE
Date of Conference: 28-31 October 2011
Date Added to IEEE Xplore: 12 January 2012
ISBN Information:
ISSN Information:
Citations are not available for this document.
Contents Cites in Papers - |
Cites in Papers - IEEE (3)
Select All
1.
Allan Riboullet, Frédéric Nabki, Yves Blaquière, Glenn Cowan, "Configurable and Intelligent Switched CMOS Current Driver Powering Arrays of Electrothermal Actuators for MEMS Switches", 2024 IEEE International Symposium on Circuits and Systems (ISCAS), pp.1-5, 2024.
2.
Shengkai Sun, Wu Ren, Zhenghui Xue, Weiming Li, "The Design of Low-Loss Phase Shifter Based on MEMS Switch", 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT), pp.1-3, 2018.
3.
M. Lipson, J. Michel, K. Wada, L.C. Kimerling, "Strong Er/sup 3+/-photon coupling", Conference on Lasers and Electro-Optics (CLEO 2000). Technical Digest. Postconference Edition. TOPS Vol.39 (IEEE Cat. No.00CH37088), pp.187-, 2000.
Cites in Papers - Other Publishers (7)
1.
Ehsan Fallah Nia, Ammar Kouki, "Ceramics for Microelectromechanical Systems Applications: A Review", Micromachines, vol.15, no.10, pp.1244, 2024.
2.
Zachary B. Milne, J. David Schall, Tevis D.B. Jacobs, Judith A. Harrison, Robert W. Carpick, "Covalent Bonding and Atomic-Level Plasticity Increase Adhesion in Silicon–Diamond Nanocontacts", ACS Applied Materials & Interfaces, vol.11, no.43, pp.40734, 2019.
3.
Ilia V. Uvarov, Nikita V. Marukhin, Victor V. Naumov, "Contact resistance and lifecycle of a single- and multiple-contact MEMS switch", Microsystem Technologies, vol.25, no.11, pp.4135, 2019.
4.
Li-Feng Wang, Qing-An Huang, Lei Han, "RF MEMS Switch", Micro Electro Mechanical Systems, pp.1039, 2018.
5.
Li-Feng Wang, Qing-An Huang, Lei Han, "RF MEMS Switch", Microbial Toxins, pp.1, 2017.
6.
Achref Yahiaoui, Emilien Lemoine, Arnaud Pothier, Pierre Blondy, "Mechanical nanogap switch for low-power on-board electronics", International Journal of Microwave and Wireless Technologies, vol.7, no.5, pp.515, 2015.
7.
Giuseppe Schiavone, Marc Desmulliez, Anthony Walton, "Integrated Magnetic MEMS Relays: Status of the Technology", Micromachines, vol.5, no.3, pp.622, 2014.
