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Integrated test chips improve IC assembly | IEEE Journals & Magazine | IEEE Xplore

Integrated test chips improve IC assembly


Abstract:

The use of test dies integrated with a semiconductor wafer to gauge environmental stresses effectively during the packaging and processing phases is discussed. These spec...Show More

Abstract:

The use of test dies integrated with a semiconductor wafer to gauge environmental stresses effectively during the packaging and processing phases is discussed. These special-purpose assembly test chips (ATCs) are designed primarily for studying failures of the package-centered and composite types. These chips usually provide a way to stress the die, and they include transducers for monitoring the die's response to the stress. A variety of structures has been used to measure parameters associated with package-related failures. Corrosion detectors, moisture detectors, mechanical stress sensors, mobile ion sensors, thermal resistance measurement circuits, and multifunction test chips are examined.<>
Published in: IEEE Circuits and Devices Magazine ( Volume: 6, Issue: 5, September 1990)
Page(s): 39 - 45
Date of Publication: 06 August 2002

ISSN Information:


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