Abstract:
Vertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed b...Show MoreMetadata
Abstract:
Vertical and lateral Scanning Joule Expansion Microscopy measurements are compared for the first time. Frequency behaviors of the thermal-mechanical system are analyzed by introducing equivalent circuits for thermo-elastic transport mechanisms. Advanced failure analysis on degradation processes of interconnects can be performed by increasing temperature sensitivities and spatial resolutions.
Published in: 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
Date of Conference: 06-10 July 2009
Date Added to IEEE Xplore: 04 September 2009
ISBN Information:
Contents 