Fully compatible integration of high density embedded DRAM with 65nm CMOS technology (CMOS5) | IEEE Conference Publication | IEEE Xplore

Fully compatible integration of high density embedded DRAM with 65nm CMOS technology (CMOS5)


Abstract:

65 nm node SoC technology has been achieved to show good yield of 8 Mbit DRAM ADM using tapered BF/sub 2/ implantation without an additional mask step, the cell size of w...Show More

Abstract:

65 nm node SoC technology has been achieved to show good yield of 8 Mbit DRAM ADM using tapered BF/sub 2/ implantation without an additional mask step, the cell size of which is 0.11 /spl mu/m/sup 2/, with 3 layers of hybrid low-k material, SiLK/BD/BLOk, and Cu integration.
Date of Conference: 08-10 December 2003
Date Added to IEEE Xplore: 03 March 2004
Print ISBN:0-7803-7872-5
Conference Location: Washington, DC, USA

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