Abstract:
This paper introduces a dual-element multiple-input-multiple-output (MIMO) microstrip antenna for device-to-device (D2D) integrated sensing and communications (ISAC) appl...Show MoreMetadata
Abstract:
This paper introduces a dual-element multiple-input-multiple-output (MIMO) microstrip antenna for device-to-device (D2D) integrated sensing and communications (ISAC) applications in the Wi-Fi 6 GHz spectrum. Each radiating element was equipped with a feeding port on one of its ends that was connected to a quarter-wavelength (0.25\lambda) line for impedance matching. The 0.35\lambda line was subsequently coupled to a crescent axed sporadic meander trace for attaining circular polarization (CP) and antenna miniaturization. In particular, axial ratio (AR) of < 3\mathbf{dB} was realized in a compact area of 5.3 cm \times 5.3 cm that is 1.1\lambda\times 1.1\lambda at the center frequency (f_{center}) of 6.33 GHz. A rectangular microstrip was integrated between the two radiating elements, and at the same time, along the edge of the dielectric substrate to render a parasitic resonance that ultimately contributed in producing the omnidirectional circularly polarized (OCP) electromagnetic (EM) waves. Furthermore, a decoupling architecture composed of multiple shorting pins that extended from the parasitic element to the defected ground was introduced for accomplishing a high average isolation of > 20 \ \mathbf{dB}. Flame-resistant (FR-4), an inexpensive dielectric substrate with low-profile of 0.03\lambda was used to yield a wide impedance bandwidth (I-BW) ranging from 4.42 GHz - 8.24 GHz. The simulated computations, and the measurement results procured within the anechoic chamber confirmed substantial agreement. Moreover, lab experiments proved the suitability of the manufactured antenna for communications applications. In contrast with con-temporary antennas, the proposed antenna occupied small area and low-profile to exhibit a wide axial ratio bandwidth (AR-BW) that combines with reasonable performance in terms of I-BW and average isolation.
Date of Conference: 19-21 March 2024
Date Added to IEEE Xplore: 03 September 2024
ISBN Information: