A 16-bit 4-MS/s SAR ADC With Dual-Segmental Bit Weight Self-Calibration | IEEE Journals & Magazine | IEEE Xplore

A 16-bit 4-MS/s SAR ADC With Dual-Segmental Bit Weight Self-Calibration


Abstract:

High-resolution successive approximation register (SAR) analog-to-digital converters (ADCs) typically require bit weight calibration. The bit weight self-calibration tech...Show More

Abstract:

High-resolution successive approximation register (SAR) analog-to-digital converters (ADCs) typically require bit weight calibration. The bit weight self-calibration technique is extensively used for its fully digital operation and low circuit complexity. Nonetheless, the comparator offset easily saturates the calibration circuit and leads to large bit weight errors in high-resolution scenarios, which needs to be cancelled in the analog domain. Moreover, the calibration needs to be repeated many times to reduce the circuit noise during calibration. These increase circuit complexity and calibration time. In this paper, a 16-bit SAR ADC with dual-segmental bit weight self-calibration is presented. The proposed calibration scheme increases the offset tolerance and suppresses the circuit noise during calibration. Therefore, precise analog-domain offset cancellation is not required, and the calibration time can be reduced. With these merits, the 16-bit SAR prototype designed in a 180-nm CMOS process achieves 16-bit linearity in only 370 clock cycles for calibration. The offset tolerance also increases to 7.5 mV. The extra analog circuit overhead for calibration reduces from high-resolution analog offset compensation circuits to only a comparator with a much-relaxed precision requirement, preserving the simple and scaling-friendly nature of SAR ADCs. With a sampling capacitance of 7 pF, the SAR ADC converts the signal at 4 MS/s with a peak signal-to-noise-and-distortion-ratio (SNDR) and a peak spurious-free dynamic range (SFDR) of 87.5 dB and 102 dBc, respectively. It consumes 10.1 mW from both 1.8-V and 3-V supplies and achieves a Schreier-figure-of-merit (FoM) of 170.5 dB at 4 MS/s.
Published in: IEEE Transactions on Circuits and Systems I: Regular Papers ( Volume: 71, Issue: 9, September 2024)
Page(s): 3961 - 3974
Date of Publication: 24 June 2024

ISSN Information:

Funding Agency:

Author image of Yanhang Chen
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Yanhang Chen (Graduate Student Member, IEEE) received the B.Eng. degree from the School of Electronics and Information Technology, Sun Yat-sen University (SYSU), Guangzhou, China, in 2021. He is currently pursuing the Ph.D. degree with the Department of Electrical and Computer Engineering, The Hong Kong University of Science and Technology (HKUST), Hong Kong, China. His current research interests include high-resolution A...Show More
Yanhang Chen (Graduate Student Member, IEEE) received the B.Eng. degree from the School of Electronics and Information Technology, Sun Yat-sen University (SYSU), Guangzhou, China, in 2021. He is currently pursuing the Ph.D. degree with the Department of Electrical and Computer Engineering, The Hong Kong University of Science and Technology (HKUST), Hong Kong, China. His current research interests include high-resolution A...View more
Author image of Qifeng Huang
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Qifeng Huang (Graduate Student Member, IEEE) received the B.E. degree from Sun Yat-sen University, Guangzhou, China, in 2020. He is currently pursuing the Ph.D. degree with the Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology. His research interests include mixed-signal integrated circuit systems, such as low-power and low-noise PLLs and high-resolution ADCs.
Qifeng Huang (Graduate Student Member, IEEE) received the B.E. degree from Sun Yat-sen University, Guangzhou, China, in 2020. He is currently pursuing the Ph.D. degree with the Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology. His research interests include mixed-signal integrated circuit systems, such as low-power and low-noise PLLs and high-resolution ADCs.View more
Author image of Yifei Fan
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Yifei Fan (Graduate Student Member, IEEE) received the B.S. degree in electronic and information engineering (EIE) from The Hong Kong Polytechnic University, Hong Kong, in 2020. He is currently pursuing the Ph.D. degree with the Mixed-Signal Sensory Integrated Circuits Laboratory for Integrated Biosensors, The Hong Kong University of Science and Technology. His research interests include novel biosensors, biomedical instr...Show More
Yifei Fan (Graduate Student Member, IEEE) received the B.S. degree in electronic and information engineering (EIE) from The Hong Kong Polytechnic University, Hong Kong, in 2020. He is currently pursuing the Ph.D. degree with the Mixed-Signal Sensory Integrated Circuits Laboratory for Integrated Biosensors, The Hong Kong University of Science and Technology. His research interests include novel biosensors, biomedical instr...View more
Author image of Qiwei Zhao
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Qiwei Zhao received the B.E. degree from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2021, and the M.Phil. degree from The Hong Kong University of Science and Technology (HKUST) in 2024.
Qiwei Zhao received the B.E. degree from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2021, and the M.Phil. degree from The Hong Kong University of Science and Technology (HKUST) in 2024.View more
Author image of Siji Huang
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Siji Huang (Student Member, IEEE) received the B.E. degree in microelectronics from Sun Yat-sen University, Guangzhou, China, in 2019. He is currently pursuing the Ph.D. degree with the Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology. His research interests include high-precision and high-speed SAR ADCs and mixed-signal integrated circuit design.
Siji Huang (Student Member, IEEE) received the B.E. degree in microelectronics from Sun Yat-sen University, Guangzhou, China, in 2019. He is currently pursuing the Ph.D. degree with the Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology. His research interests include high-precision and high-speed SAR ADCs and mixed-signal integrated circuit design.View more
Author image of Jie Yuan
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Jie Yuan (Senior Member, IEEE) received the B.S. degree in electrical engineering from Tsinghua University in 2000 and the Ph.D. degree in electrical engineering from the University of Pennsylvania, Philadelphia, in 2006. Since 2006, he has been a Faculty Member with the Electronic and Computer Engineering Department, The Hong Kong University of Science and Technology, where he is currently an Associate Professor. He is a...Show More
Jie Yuan (Senior Member, IEEE) received the B.S. degree in electrical engineering from Tsinghua University in 2000 and the Ph.D. degree in electrical engineering from the University of Pennsylvania, Philadelphia, in 2006. Since 2006, he has been a Faculty Member with the Electronic and Computer Engineering Department, The Hong Kong University of Science and Technology, where he is currently an Associate Professor. He is a...View more

Author image of Yanhang Chen
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Yanhang Chen (Graduate Student Member, IEEE) received the B.Eng. degree from the School of Electronics and Information Technology, Sun Yat-sen University (SYSU), Guangzhou, China, in 2021. He is currently pursuing the Ph.D. degree with the Department of Electrical and Computer Engineering, The Hong Kong University of Science and Technology (HKUST), Hong Kong, China. His current research interests include high-resolution ADCs and mixed-signal integrated circuits.
Yanhang Chen (Graduate Student Member, IEEE) received the B.Eng. degree from the School of Electronics and Information Technology, Sun Yat-sen University (SYSU), Guangzhou, China, in 2021. He is currently pursuing the Ph.D. degree with the Department of Electrical and Computer Engineering, The Hong Kong University of Science and Technology (HKUST), Hong Kong, China. His current research interests include high-resolution ADCs and mixed-signal integrated circuits.View more
Author image of Qifeng Huang
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Qifeng Huang (Graduate Student Member, IEEE) received the B.E. degree from Sun Yat-sen University, Guangzhou, China, in 2020. He is currently pursuing the Ph.D. degree with the Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology. His research interests include mixed-signal integrated circuit systems, such as low-power and low-noise PLLs and high-resolution ADCs.
Qifeng Huang (Graduate Student Member, IEEE) received the B.E. degree from Sun Yat-sen University, Guangzhou, China, in 2020. He is currently pursuing the Ph.D. degree with the Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology. His research interests include mixed-signal integrated circuit systems, such as low-power and low-noise PLLs and high-resolution ADCs.View more
Author image of Yifei Fan
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Yifei Fan (Graduate Student Member, IEEE) received the B.S. degree in electronic and information engineering (EIE) from The Hong Kong Polytechnic University, Hong Kong, in 2020. He is currently pursuing the Ph.D. degree with the Mixed-Signal Sensory Integrated Circuits Laboratory for Integrated Biosensors, The Hong Kong University of Science and Technology. His research interests include novel biosensors, biomedical instruments, and high-resolution analog-to-digital converters.
Yifei Fan (Graduate Student Member, IEEE) received the B.S. degree in electronic and information engineering (EIE) from The Hong Kong Polytechnic University, Hong Kong, in 2020. He is currently pursuing the Ph.D. degree with the Mixed-Signal Sensory Integrated Circuits Laboratory for Integrated Biosensors, The Hong Kong University of Science and Technology. His research interests include novel biosensors, biomedical instruments, and high-resolution analog-to-digital converters.View more
Author image of Qiwei Zhao
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Qiwei Zhao received the B.E. degree from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2021, and the M.Phil. degree from The Hong Kong University of Science and Technology (HKUST) in 2024.
Qiwei Zhao received the B.E. degree from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2021, and the M.Phil. degree from The Hong Kong University of Science and Technology (HKUST) in 2024.View more
Author image of Siji Huang
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Siji Huang (Student Member, IEEE) received the B.E. degree in microelectronics from Sun Yat-sen University, Guangzhou, China, in 2019. He is currently pursuing the Ph.D. degree with the Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology. His research interests include high-precision and high-speed SAR ADCs and mixed-signal integrated circuit design.
Siji Huang (Student Member, IEEE) received the B.E. degree in microelectronics from Sun Yat-sen University, Guangzhou, China, in 2019. He is currently pursuing the Ph.D. degree with the Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology. His research interests include high-precision and high-speed SAR ADCs and mixed-signal integrated circuit design.View more
Author image of Jie Yuan
Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Sai kung, Hong Kong
Jie Yuan (Senior Member, IEEE) received the B.S. degree in electrical engineering from Tsinghua University in 2000 and the Ph.D. degree in electrical engineering from the University of Pennsylvania, Philadelphia, in 2006. Since 2006, he has been a Faculty Member with the Electronic and Computer Engineering Department, The Hong Kong University of Science and Technology, where he is currently an Associate Professor. He is also a Post-Graduate Coordinator of the ECE Department and the In Charge of Postgraduate Affairs with the ECE Department. His research interests include sensory IC design ADC, CMOS imaging sensors, integrated bio-cellular sensing systems, wearable sensors, and energy harvesting. He served as the Technical Program Committee Co-Chair for the IEEE Biomedical Circuits and Systems Conference in 2009 and the Chair of the Biomedical Circuits and Systems Technical Committee of the IEEE CAS from 2012 to 2014 and the Analog Signal Processing Technical Committee of the IEEE CAS Society from 2017 to 2019. He was an Associate Editor of IEEE Transactions on Biomedical Circuits and Systems and IEEE Transactions on Circuits and Systems—II: Express Briefs and a Guest Editor of IEEE Transactions on Circuits and Systems—I: Regular Papers.
Jie Yuan (Senior Member, IEEE) received the B.S. degree in electrical engineering from Tsinghua University in 2000 and the Ph.D. degree in electrical engineering from the University of Pennsylvania, Philadelphia, in 2006. Since 2006, he has been a Faculty Member with the Electronic and Computer Engineering Department, The Hong Kong University of Science and Technology, where he is currently an Associate Professor. He is also a Post-Graduate Coordinator of the ECE Department and the In Charge of Postgraduate Affairs with the ECE Department. His research interests include sensory IC design ADC, CMOS imaging sensors, integrated bio-cellular sensing systems, wearable sensors, and energy harvesting. He served as the Technical Program Committee Co-Chair for the IEEE Biomedical Circuits and Systems Conference in 2009 and the Chair of the Biomedical Circuits and Systems Technical Committee of the IEEE CAS from 2012 to 2014 and the Analog Signal Processing Technical Committee of the IEEE CAS Society from 2017 to 2019. He was an Associate Editor of IEEE Transactions on Biomedical Circuits and Systems and IEEE Transactions on Circuits and Systems—II: Express Briefs and a Guest Editor of IEEE Transactions on Circuits and Systems—I: Regular Papers.View more

Contact IEEE to Subscribe

References

References is not available for this document.