Wire Bond Design

Summary

Wire bonding plays a key role in the interconnection of package or SiP; using wire bonding chip pins can be electrically connected with bonding pads and traces in substrate. The rationality and accuracy of wire bond design is also crucial for SiP product yield and reliability. Expedition has the most advanced bond wire model, and can meet the most complex wire bond design and manufacture requirements; it supports continuous line, arc curve and spline curve forms of wire bond bend, and complex multilayer wire bond design, In the process of adding bond wire, if the bonding line shows a red arrow, this suggests that the bond wire length is not within the scope of the setting. An inward arrow indicates the current length is too long and should move in the direction of the chip; an outward arrow indicates the current length is too short and should move away from the chip.