Inspection challenges of leadless packages

The advantages of leadless devices are many, but along with the new technology come new inspection challenges. This paper explores the post-singulation inspection challenges related to the implementation of leadless packages from the perspective of a user implementing a new packaging technology, as well as that of a supplier of inspection tools working to address unique challenges inherent in the package design. Inspection challenges to be reviewed include coplanarity, pad integrity, board quality, package sides and mark inspection.