Abstract:
This paper presents a millimeter-wave low-pass filter to investigate the RF performance of passive structures in a lab-level thin metal micro-nano processing technology. ...Show MoreMetadata
Abstract:
This paper presents a millimeter-wave low-pass filter to investigate the RF performance of passive structures in a lab-level thin metal micro-nano processing technology. It consists of 3-stage periodic stepped-impedance cell to have a slow-wave structure to offer a high attenuation of stop band with a compact size. The total size of the chip is less than 1.1 mm2. It achieves an insertion loss of less than 2 dB at a frequency range from 0 to 110 GHz with a measured cut-off frequency around 40 GHz. A rejection of higher than 20 dB is measured in a stopband from 52 to 110 GHz, which is larger than 2 times of fundamental frequency. The measurement agrees well with the simulation results. It shows the potential of RF passives in a lab-level thinner metal thickness technology towards monolithic microwave integrated circuits.
Published in: 2023 IEEE MTT-S International Wireless Symposium (IWS)
Date of Conference: 14-17 May 2023
Date Added to IEEE Xplore: 29 August 2023
ISBN Information:
Funding Agency:
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- IEEE Keywords
- Index Terms
- Low-pass ,
- Metal Thickness ,
- Coplanar Waveguide ,
- Insertion Loss ,
- Stop Band ,
- Research And Development ,
- Wireless ,
- Dielectric Constant ,
- Electron Beam ,
- Filter Size ,
- Silicon Substrate ,
- Electron Beam Lithography ,
- Active Devices ,
- Passive Devices ,
- Lift-off Process ,
- Low Insertion Loss ,
- Advanced Design System ,
- Electron Beam Deposition
- Author Keywords
Keywords assist with retrieval of results and provide a means to discovering other relevant content. Learn more.
- IEEE Keywords
- Index Terms
- Low-pass ,
- Metal Thickness ,
- Coplanar Waveguide ,
- Insertion Loss ,
- Stop Band ,
- Research And Development ,
- Wireless ,
- Dielectric Constant ,
- Electron Beam ,
- Filter Size ,
- Silicon Substrate ,
- Electron Beam Lithography ,
- Active Devices ,
- Passive Devices ,
- Lift-off Process ,
- Low Insertion Loss ,
- Advanced Design System ,
- Electron Beam Deposition
- Author Keywords