On-Chip CPW Low-Pass Filter with 50–110 GHz Bandstop in 400 nm Metal Thickness Technology Towards Lab-Level Ka-Band MMICs | IEEE Conference Publication | IEEE Xplore

On-Chip CPW Low-Pass Filter with 50–110 GHz Bandstop in 400 nm Metal Thickness Technology Towards Lab-Level Ka-Band MMICs


Abstract:

This paper presents a millimeter-wave low-pass filter to investigate the RF performance of passive structures in a lab-level thin metal micro-nano processing technology. ...Show More

Abstract:

This paper presents a millimeter-wave low-pass filter to investigate the RF performance of passive structures in a lab-level thin metal micro-nano processing technology. It consists of 3-stage periodic stepped-impedance cell to have a slow-wave structure to offer a high attenuation of stop band with a compact size. The total size of the chip is less than 1.1 mm2. It achieves an insertion loss of less than 2 dB at a frequency range from 0 to 110 GHz with a measured cut-off frequency around 40 GHz. A rejection of higher than 20 dB is measured in a stopband from 52 to 110 GHz, which is larger than 2 times of fundamental frequency. The measurement agrees well with the simulation results. It shows the potential of RF passives in a lab-level thinner metal thickness technology towards monolithic microwave integrated circuits.
Date of Conference: 14-17 May 2023
Date Added to IEEE Xplore: 29 August 2023
ISBN Information:
Conference Location: Qingdao, China

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