Loading web-font TeX/Math/Italic
Design and Analysis of a Mode-Coupler-Based Multimode Multidrop Si Dielectric Waveguide Channel for Sub-THz/THz Interconnect | IEEE Journals & Magazine | IEEE Xplore

Design and Analysis of a Mode-Coupler-Based Multimode Multidrop Si Dielectric Waveguide Channel for Sub-THz/THz Interconnect


Abstract:

This article presents a G -band mode-coupler-based multimode multidrop Si dielectric waveguide (DWG) for sub-terahertz (THz)/THz interconnect. Four types of mode coupl...Show More

Abstract:

This article presents a G -band mode-coupler-based multimode multidrop Si dielectric waveguide (DWG) for sub-terahertz (THz)/THz interconnect. Four types of mode couplers, including E_{11}^{y}E_{11}^{y} , E_{11}^{y}E_{21}^{y} , E_{11}^{y}E_{31}^{y} , and quasi-TEM to E_{11}^{y} mode couplers, are analyzed, designed, and demonstrated. The quasi-TEM to E_{11}^{y} coupler is a microstrip line (MSL)-to-DWG transition. E_{11}^{y} to E_{21}^{y} and E_{11}^{y} to E_{31}^{y} mode couplers with satisfied phase matching enable two more mode transmissions along the same waveguide. The mode-coupling theory, including the coupling coefficient, the coupling efficiency, crosstalk, and bandwidth, is studied and analyzed mathematically and guides the development of a one-side tapered coupler to boost the bandwidth. Tapered structures are employed as the smooth transition between DWG sections and mode filters to minimize the mode interference in (de)multiplexers and as the radiation terminals to reduce the reflection. The measured minimum transition loss is about 5 dB with the 3-dB bandwidth of 143–200, 151–185, and 155–174 GHz for the three modes, respectively, and the measured crosstalks between modes are less than −26 dB. A multimode multidrop sub-THz interconnect system is also demonstrated with CMOS-based transmitters (TXs)/receivers (RXs) and achieves an aggregate data rate of 65 Gb/s and the energy efficiency of 1.6 pJ/b with a bit error rate (BER) of 10^{-12} .
Published in: IEEE Transactions on Microwave Theory and Techniques ( Volume: 72, Issue: 1, January 2024)
Page(s): 111 - 123
Date of Publication: 11 July 2023

ISSN Information:

Funding Agency:


Contact IEEE to Subscribe

References

References is not available for this document.