Abstract:
Optical waveguides are integrated into a Sea-of-Leads (SoL) wafer-level package. A photosensitive polycarbonate composite is incorporated to provide a buried air-gap clad...Show MoreMetadata
Abstract:
Optical waveguides are integrated into a Sea-of-Leads (SoL) wafer-level package. A photosensitive polycarbonate composite is incorporated to provide a buried air-gap cladding that allows a refractive index contrast, /spl Delta/n, between waveguide core and cladding regions of /spl Delta/n = 0.52. The final package contains 1000 electrical input/output (I/O) interconnects and 32 large-area optical waveguides for electrical chip-to-chip and optical intra-chip clock or data interconnection, respectively. Monolithic fabrication of passive optical interconnect components is described.
Published in: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)
Date of Conference: 05-05 June 2002
Date Added to IEEE Xplore: 07 August 2002
Print ISBN:0-7803-7216-6