Physicochemical, Functional and Viscosity Profile of Starches from Three Banana Cultivars as Affected by Oxidation and Acetylation | IEEE Conference Publication | IEEE Xplore

Physicochemical, Functional and Viscosity Profile of Starches from Three Banana Cultivars as Affected by Oxidation and Acetylation


Abstract:

Banana, a very rich starchy food crop, undergoes postharvest losses in the developing countries. Acetylated and oxidized banana starches were investigated for their physi...Show More

Abstract:

Banana, a very rich starchy food crop, undergoes postharvest losses in the developing countries. Acetylated and oxidized banana starches were investigated for their physicochemical properties in order to fully exploit their potentials for industrial applications. Starches extracted from three banana cultivars, Dwarf cavendish, Gros michel, and Musa wild banana, were modified and analyzed for their chemical, functional, pasting, and rheological properties; and FTIR spectroscopy. Modification significantly (p< 0.05) increased the oil absorption capacity and solubility index of the banana starches. Among the banana cultivars, the swelling capacity and solubility index of Musa wild starches were more enhanced by acetylation and oxidation compared to others. Modification significantly increased the pasting viscosities and temperature of the banana starches. Oxidation increased the breakdown viscosity of the starches from the banana cultivars while acetylation generally reduced it. The pasting temperature of modified banana starches (78.65-82.75°C) was higher compared to that of native starches (78.30-79.85°C). There were no remarkable changes in the viscosity profile of the native and modified banana starches, they both exhibited shear thinning behaviour. Oxidized and acetylated banana starches may be very valuable ingredients in food applications as thickeners and binders.
Date of Conference: 05-07 April 2023
Date Added to IEEE Xplore: 22 May 2023
ISBN Information:
Conference Location: Omu-Aran, Nigeria

Contact IEEE to Subscribe

References

References is not available for this document.