Optimal actuator shape design with input and state constraints for a wafer heating application | IEEE Conference Publication | IEEE Xplore

Optimal actuator shape design with input and state constraints for a wafer heating application


Abstract:

Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the ...Show More

Abstract:

Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.
Date of Conference: 10-12 July 2019
Date Added to IEEE Xplore: 29 August 2019
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ISSN Information:

Conference Location: Philadelphia, PA, USA

I. Introduction

A crucial step in the production of Integrated Circuits (ICs) is the projection of the pattern of electronic connections on a silicon wafer coated with a photoresist. The light source used to project the pattern on the wafer causes the wafer to heat up and expand, which leads to a deteriorated imaging quality. With the critical dimensions of the projected pattern approaching the subnanometer range, wafer heating has become a determining factor for the quality of the produced ICs (see e.g. [1]–[3]).

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