Abstract:
We have successfully mass-produced novel stacked back-illuminated CMOS image sensors (BI-CIS). In the new CIS, we introduced advanced Cu2Cu hybrid bonding that we had dev...Show MoreMetadata
Abstract:
We have successfully mass-produced novel stacked back-illuminated CMOS image sensors (BI-CIS). In the new CIS, we introduced advanced Cu2Cu hybrid bonding that we had developed. The electrical test results showed that our highly robust Cu2Cu hybrid bonding achieved remarkable connectivity and reliability. The performance of image sensor was also investigated and our novel stacked BI-CIS showed favorable results.
Published in: 2016 IEEE International Electron Devices Meeting (IEDM)
Date of Conference: 03-07 December 2016
Date Added to IEEE Xplore: 02 February 2017
ISBN Information:
Electronic ISSN: 2156-017X
Contents 