Electroless techniques for EMI shieldings | IEEE Conference Publication | IEEE Xplore

Electroless techniques for EMI shieldings


Abstract:

This paper discusses the progress made in electroless plating techniques for fabrication of EMI shieldings. Although, there are alternative techniques such as zinc arc sp...Show More

Abstract:

This paper discusses the progress made in electroless plating techniques for fabrication of EMI shieldings. Although, there are alternative techniques such as zinc arc spray, Cu or Ni conductive paints and RF/magnetron sputtering for deposition of conductive coatings on plastics, electroless techniques have advantage of better uniformity and adhesivity of coatings as well as higher shielding effectiveness. However, these techniques have disadvantages in respect of limited bath life and hazardous chemicals. It is suggested that if these problems are addressed jointly by academicians, industry and suppliers, these techniques can be widely used for the manufacture of EMI shieldings.
Date of Conference: 08-08 December 1997
Date Added to IEEE Xplore: 06 August 2002
Print ISBN:81-900652-0-3
Conference Location: Hyderabad, India
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