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3D engineered neural networks coupled to Micro-Electrode Arrays: Development of an innovative in-vitro experimental model for neurophysiological studies | IEEE Conference Publication | IEEE Xplore

3D engineered neural networks coupled to Micro-Electrode Arrays: Development of an innovative in-vitro experimental model for neurophysiological studies


Abstract:

2D neuronal populations coupled to Micro-Electrode-Arrays (MEAs) constitute a well-established experimental in-vitro platform to study neurobiology, network electrophysio...Show More
Notes: As originally published there are various errors in the document. The authors omitted the following information: (1) in the acknowledgment, pp. 957 the following needs to be added: "Research supported by Brainbow ... The 3D MEA development is supported by the 3DNeuroN project in the European Union's Seventh Framework Programme, Future and Emerging Technologies, grant agreement no 296590 (see also (http://www.3dneuron.eu/ ). (2) In addition, three references were omitted after reference 5, pp. 957 second column, first paragraph: (A) A. Schober, U. Fernekorn, S. Singh et al., "Mimicking the biological world: methods for the 3D structuring of artificial cellular environments," Engineering in Life Sciences, vol. 13, no. 4, pp. 352-367, 2013. (B) A. Williamson, S. Singh, U. Fernekorn, and A. Schober, "The future of the patient-specific Body-on-a-chip," Lab on a Chip, vol. 13, no. 18, pp. 3471-3480, 2013. (C) At the end of the introduction section the following citation should be included on p. 958: P. Husar, D. Laqua, M. Fischer, K. Lilienthal, J. Hampl, U. Fernekorn, A. Schober, "Hybrid three-dimensional sensor array, in particular for measuring electrogenic cell assemblies, and measuring assembly, 2010" [DE 10 2010 000 565.7//PCT/EP2011/052638]."

Abstract:

2D neuronal populations coupled to Micro-Electrode-Arrays (MEAs) constitute a well-established experimental in-vitro platform to study neurobiology, network electrophysiology, and basic injury-disease mechanisms. They are also widely used for neuropharmacological screening and neurotoxicity tests. Here we propose a new experimental in-vitro paradigm constituted by 3D engineered networks coupled to both planar and innovative 3D-MEAs. The advantage of such a model is clearly its improved representation of the actual in-vivo environment while maintaining some of the advantages (control, observation) of in-vitro systems. We constructed a physically connected 3D neural network and we demonstrate how the 3D network dynamic differs from the corresponding 2D model, resembling the one detected in the invivo situation. The obtained results suggest new avenues for the use of such 3D models for neurophysiological studies or for the development of biohybrid microsystems for in-vivo neural repair.
Notes: As originally published there are various errors in the document. The authors omitted the following information: (1) in the acknowledgment, pp. 957 the following needs to be added: "Research supported by Brainbow ... The 3D MEA development is supported by the 3DNeuroN project in the European Union's Seventh Framework Programme, Future and Emerging Technologies, grant agreement no 296590 (see also (http://www.3dneuron.eu/ ). (2) In addition, three references were omitted after reference 5, pp. 957 second column, first paragraph: (A) A. Schober, U. Fernekorn, S. Singh et al., "Mimicking the biological world: methods for the 3D structuring of artificial cellular environments," Engineering in Life Sciences, vol. 13, no. 4, pp. 352-367, 2013. (B) A. Williamson, S. Singh, U. Fernekorn, and A. Schober, "The future of the patient-specific Body-on-a-chip," Lab on a Chip, vol. 13, no. 18, pp. 3471-3480, 2013. (C) At the end of the introduction section the following citation should be included on p. 958: P. Husar, D. Laqua, M. Fischer, K. Lilienthal, J. Hampl, U. Fernekorn, A. Schober, "Hybrid three-dimensional sensor array, in particular for measuring electrogenic cell assemblies, and measuring assembly, 2010" [DE 10 2010 000 565.7//PCT/EP2011/052638]."
Date of Conference: 06-08 November 2013
Date Added to IEEE Xplore: 02 January 2014
Electronic ISBN:978-1-4673-1969-0

ISSN Information:

Conference Location: San Diego, CA, USA

References

References is not available for this document.