Abstract:
The characteristics of the tape automated bonding (TAB) technique are discussed. New bumping technologies and inner lead bonding methods are described. It is concluded th...Show MoreMetadata
Abstract:
The characteristics of the tape automated bonding (TAB) technique are discussed. New bumping technologies and inner lead bonding methods are described. It is concluded that the TAB technique is applicable for future high-pin-count and high-speed devices: the existing technology offers reliable interconnects.<>
Published in: 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium
Date of Conference: 07-09 May 1990
Date Added to IEEE Xplore: 06 August 2002
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